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Technologies / Environment Environment

NIST Researchers Develop Photonic Chip Packaging That Can Withstand Extreme Environments

Source: nistElectronics March 30, 2026 · 05:00
NIST Researchers Develop Photonic Chip Packaging That Can Withstand Extreme Environments
Photo by Jimmy Chan · Pexels
From the publisher
The advance could allow these technologies to operate in deep-space probes, inside nuclear reactors, in ultrahigh vacuum systems, and at temperatures both near absolute zero and in scorchingly hot industrial settings.

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